Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
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United States of America Patent
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Sep 6, 2005
Grant Date -
N/A
app pub date -
Sep 4, 1997
filing date -
Sep 5, 1996
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Abstract
A semiconductor device connecting structure for connecting a semiconductor IC 7 onto a substrate 13. A bonding layer 31 is placed between the substrate 13 and the semiconductor IC 7 to accomplish adhesion therein. This bonding layer includes an ACF 32 as a bonding material for joining said semiconductor IC 7 onto said substrate 13 and a space 33 formed within the ACF 32. Even if the IC 7 deforms due to heat or the like, the deformation is absorbed by the space a 33, whereupon the connecting conditions of bumps 28, 29 can not be unstable.
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