Semiconductor workpiece apparatus
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United States of America Patent
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Sep 6, 2005
Grant Date -
Apr 1, 2004
app pub date -
Sep 30, 2002
filing date -
Sep 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Various embodiments of an apparatus for holding and processing semiconductor workpieces are provided. In one aspect, an apparatus is provided that includes a first base, a second base and three elongated members coupled to and between the first base and the second base. The three elongated members are spatially arranged so that a semiconductor workpiece may be positioned therebetween. Each of the elongated members has a first lateral edge, a second lateral edge and at least one radially inwardly projecting member. The at least one radially inwardly projecting member has a third lateral edge, a fourth lateral edge and an upper surface for receiving a portion of the semiconductor workpiece and a lower surface. The third lateral edge is displaced laterally inward from the first lateral edge and the fourth lateral edge is displaced laterally inward from the second lateral edge.
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