Lead frame having chip mounting part and leads of different thicknesses
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 30, 2005
Grant Date -
Aug 5, 2004
app pub date -
Nov 1, 2001
filing date -
Nov 1, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame according to this invention comprises: a semiconductor chip mounting part having an engagement hole formed on its one side; and a lead part including a supporting lead fit in said engagement hole of the semiconductor chip mounting part so as to support said semiconductor chip mounting part, said supporting lead being made of a thinner-walled material than that of the semiconductor chip mounting part and an outer lead arranged in parallel to said supporting lead. The supporting lead involves a fitting portion having a wider width than a lead width of the supporting lead and fit in said engagement hole of said semiconductor chip mounting part.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully