Lead-free alloy
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United States of America Patent
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Aug 30, 2005
Grant Date -
Oct 21, 2004
app pub date -
Jul 7, 2002
filing date -
Jul 5, 2001
priority date (Note) -
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Abstract
Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt. %. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder paste, thin sheet, ribbon foil, perform etc. The alloy has improved mechanical and electrical properties in comparison with conventional Tin-Lead alloys Sn9Zn and 63Sn37Pb.
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