Reflow soldering method
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United States of America Patent
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Aug 30, 2005
Grant Date -
Jan 15, 2004
app pub date -
Apr 15, 2003
filing date -
Apr 16, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
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