Dielectric film
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United States of America Patent
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Aug 23, 2005
Issued Date -
N/A
app pub date -
Jun 13, 2003
filing date -
Jun 14, 2002
priority date (Note) -
Expired
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Abstract
A low k porous dielectric film is described wherein the exposed surface or surfaces of the film are substantially non-porous. A densification method is described for treating such exposed surfaces to render porous surfaces non-porous.
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