Enhanced polyisobutylene modified hot melt adhesive formulation
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United States of America Patent
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Aug 16, 2005
Grant Date -
Oct 14, 2004
app pub date -
Apr 8, 2003
filing date -
Apr 8, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved hot melt adhesive includes a base polymer and a PIB modifier that is made up of a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position. The modifier may function to improve the loop tack and/or the peel adhesion of the hot melt adhesive.
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