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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SONY CHEMICAL CORP	6-3 NIHONBASHI-MUROMACHI 1-CHOME CHUO-KU TOKYO 103-0022

International Classification(s)

• C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Akamatsu, Tadashi	Kanuma, JP	7	23
Hasegawa, Masatoshi	Chiba, JP	62	989
Ishii, Junichi	Kanuma, JP	91	1350
Nomura, Mamiko	Kanuma, JP	8	43

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 09, 2005	US,6927274,B2   US6927274B2	GRANTED PATENT AS SECOND PUBLICATION
July 01, 2004	US,20040127595,A1   US20040127595A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 6927274

Resin compositions, processes for preparing the resin compositions and processes for forming resin films

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