Ultrasonic manufacturing apparatus
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United States of America Patent
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Aug 9, 2005
Issued Date -
N/A
app pub date -
Apr 28, 2003
filing date -
Aug 26, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
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