Closed-loop, rapid manufacturing of three-dimensional components using direct metal deposition
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United States of America Patent
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Aug 2, 2005
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app pub date -
Sep 27, 2000
filing date -
Jun 30, 1998
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Abstract
Multiple criteria are monitored and controlled to enhance the success of direct-metal deposition, including greater control over factors such as deposit layer height/thickness, sub-harmonic vibration, contour path shape, powder mass flow, and deposition speed, and stress accumulation. Sensors are used to monitor some or all of the following parameters during the deposition process: deposit height, width, temperature, and residual stress. A predetermined limit with respect to the yield strength of the material is preferably set. If the stress exceeds that limit sensors will automatically introduce one or more remedial measures, the priority of which is established using a look-up table generated in accordance with prior experimental knowledge. To control temperature induced distortion and stress, an infrared temperature detector may be used in conjunction with a controller to reduce temperature, increase speed and decreased power for purpose of stress management.
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