Heat dissipating structure of printed circuit board and fabricating method thereof
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United States of America Patent
Stats
-
Jul 26, 2005
Grant Date -
Aug 12, 2004
app pub date -
Nov 25, 2003
filing date -
Nov 26, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A heat dissipating structure of a printed circuit board on which a circuit pattern is provided so that a heat generating part can be mounted, and which has a through hole formed at a site where the heat generating part is mounted from a surface on which the heat generating part is mounted to the opposite surface. A heat dissipating member made of a material with a thermal conductivity higher than a board of the printed circuit board, and having a shape worked so that the heat dissipating member can be inserted into the through hole is mounted in the through hole with an adhesive interposed therebetween. Heat generated from a heat generating part is transferred by way of a heat dissipating member to as far as a conductor of the GND surface or heat dissipating fins.
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