Die surface magnetic field shield
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United States of America Patent
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Jul 26, 2005
Grant Date -
N/A
app pub date -
Jun 20, 2002
filing date -
Jun 20, 2002
priority date (Note) -
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Abstract
A semiconductor topography is provided which includes a magnetic field shield layer formed upon a semiconductor device. In particular, the semiconductor topography may include a ferromagnetic layer adapted to shield underlying layers from external magnetic fields. Such a ferromagnetic layer may include either ferrite and/or non-ferrite materials. In some embodiments, the semiconductor topography may include a magnetic field shield layer with a different pattern configuration than an adjacent passivation layer. Consequently, a method for processing a semiconductor topography which includes patterning a magnetic field shield layer to form openings other than bond pad openings within the semiconductor topography is provided.
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