Device for polishing outer peripheral edge of semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 26, 2005
Grant Date -
N/A
app pub date -
Oct 18, 2000
filing date -
Oct 18, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A polishing machine for a peripheral edge of a semiconductor wafer comprises a rotary mechanism 2 which rotates a stack 1 of semiconductor wafers 4 mounted thereon, and a polishing mechanism 3 which is arranged to be movable in the radial direction of the rotary mechanism 2 and polishes the peripheral edges of the rotating semiconductor wafers 4 by means of contactless polishing. Minute gaps s are formed between the rotary column 10 of the polishing mechanism 3 and the stack 1 of semiconductor wafers 4, and polishing solution is drawn into these minute gaps s. The peripheral edges of the semiconductor wafers 4 are polished by means of contactless polishing, using polishing abrasive particles included in polishing solution.
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Cited Art Landscape
Patent Citation Ranking
- 5 Citation Count
- H01L Class
- 2.00 % this patent is cited more than
- 20 Age