Method and apparatus for decapping integrated circuit packages
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United States of America Patent
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Jul 12, 2005
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N/A
app pub date -
Jul 10, 2002
filing date -
Jul 11, 2001
priority date (Note) -
Expired
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Abstract
The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.
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