Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
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United States of America Patent
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Jul 12, 2005
Grant Date -
Nov 20, 2003
app pub date -
May 17, 2002
filing date -
May 17, 2002
priority date (Note) -
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Abstract
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.
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