Device for applying solder globules
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United States of America Patent
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Jul 12, 2005
Issued Date -
N/A
app pub date -
Apr 12, 2002
filing date -
Apr 12, 2001
priority date (Note) -
Expired
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Abstract
An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.
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