Multi-barrel die transfer apparatus and method for transferring dies therewith

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6915551
APP PUB NO 20040020039A1
SERIAL NO

10322718

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

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Patent Owner(s)

Patent OwnerAddress
SYMBOL TECHNOLOGIES INCHOLTSVILLE NY

International Classification(s)

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  • 2002 Application Filing Year
  • B23P Class
  • 1001 Applications Filed
  • 308 Patents Issued To-Date
  • 30.77 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20022003200420052006200720082009201020110255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arneson, Michael R Westminister, MD 76 3059
Bandy, William R Gambrills, MD 88 3795

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Patent Citation Ranking

  • 1 Citation Count
  • B23P Class
  • 7.26 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges30268702285512201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7091 - 100100 +020406080100120140160180200220240260280300

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