Layer transfer methods
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United States of America Patent
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Jul 5, 2005
Grant Date -
Apr 29, 2004
app pub date -
Jul 9, 2003
filing date -
Jul 17, 2002
priority date (Note) -
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Abstract
Methods for transferring a layer of material from a source substrate having a zone of weakness onto a support substrate to fabricate a composite substrate are described. An implementation includes forming at least one recess in at least one of the source and support substrates, depositing material onto at least one of a front face of the source substrate and a front face of the support substrate, pressing the front faces of the source and support substrates together to bond the substrates, and detaching a transfer layer from the source substrate along the zone of weakness. When the front faces are pressed together, any excess material is received by the recess. The recess may advantageously include an opening in the front face of at least one of the source substrate and the support substrate.
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