Method of manufacturing electronic packaging device with insertable leads
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United States of America Patent
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Jul 5, 2005
Grant Date -
Jan 16, 2003
app pub date -
Sep 11, 2002
filing date -
Jan 31, 2000
priority date (Note) -
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Abstract
A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.
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