Plating method
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United States of America Patent
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Jun 28, 2005
Grant Date -
Jan 29, 2004
app pub date -
Nov 23, 2002
filing date -
Dec 14, 2001
priority date (Note) -
Expired
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Abstract
Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.
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