Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates
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United States of America Patent
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Jun 28, 2005
Grant Date -
Aug 29, 2002
app pub date -
Dec 11, 2000
filing date -
Dec 11, 2000
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Abstract
The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.
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