Spherical semiconductor device and method for fabricating the same
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United States of America Patent
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Jun 21, 2005
Grant Date -
Jan 30, 2003
app pub date -
Sep 27, 2002
filing date -
Jul 9, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.
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