Lead frame and semiconductor device using the lead frame and method of manufacturing the same
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United States of America Patent
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Jun 21, 2005
Issued Date -
N/A
app pub date -
Jul 16, 2001
filing date -
Mar 18, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a substrate, a semiconductor chip mounted on one surface of the substrate, wherein the semiconductor chip has an integrated circuit and bonding pads formed on a main surface thereof. The main surface of the semiconductor chip has a quadrilateral shape with the bonding pads being disposed along four sides of the main surface. A plurality of conductors is disposed on the one surface of the substrate so as to surround the semiconductor chip along four sides thereof and a plurality of bonding wires electrically connect the bonding pads with tips of the conductors, respectively. A resin body seals the semiconductor chip, the conductors and the plurality of bonding wires. A pitch between adjacent bonding pads increases in a direction toward four corners defined by the four sides of the main surface of the semiconductor chip.
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