Method and device for treating semiconductor substrates
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United States of America Patent
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Jun 21, 2005
Grant Date -
Mar 25, 2004
app pub date -
Jun 23, 2003
filing date -
Dec 23, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a method and to a device for treating semiconductor substrates. In conventional systems, the especially uncoated semiconductor substrates are fed to a treatment device through a charging sluice, said charging sluice adjoining a transfer chamber. A plurality of treatment chambers can be charged with the semiconductor substrates to be treated from said transfer chamber by first evacuating the transfer chamber and the treatment chamber and then opening the connecting door between the transfer chamber and the treatment chamber. The aim of the invention is to improve this system. To this end, at least one of the treatment chambers is operated at a low pressure or atmospheric pressure and the transfer chamber is flooded with an inert gas before the connecting door associated with the treatment chamber is opened, while a predetermined pressure difference between the transfer chamber and the treatment chamber is maintained.
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