Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
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United States of America Patent
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Jun 21, 2005
Grant Date -
Jan 15, 2004
app pub date -
Aug 23, 2001
filing date -
Aug 24, 2000
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Abstract
The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
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