Micromechanical component
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United States of America Patent
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Jun 14, 2005
Grant Date -
Feb 5, 2004
app pub date -
Jul 6, 2002
filing date -
Jul 25, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micromechanical component includes a substrate and a cover layer deposited on the substrate, underneath the cover layer, a region of porous material being provided which mechanically supports and thermally insulates the cover layer. On the cover layer, a heating device is provided to heat the cover layer above the region; and above the region, a detector is provided to measure an electric property of a heated medium provided above the region on the cover layer.
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