Process for molding on a substrate
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United States of America Patent
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Jun 14, 2005
Grant Date -
Jun 10, 2004
app pub date -
Dec 4, 2002
filing date -
Dec 4, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process of molding a component on a substrate utilizes a substrate having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange has a projecting, continuous circuitous ridge that forms a seal between the substrate and an upper mold segment. The process allows a substantially flash free molded component to be formed directly on a substrate, thus eliminating the need for a separate flash removal step.
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