Method and apparatus for drying substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6904702
APP PUB NO 20040031168A1
SERIAL NO

10438002

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The substrate drying apparatus has a substrate processing vessel 1, a substrate supporting section for supporting plural substrates 2 in a standing condition and lined up condition in the interior of the substrate processing vessel 1, fluid reservoir section 3 for drying provided at an upward predetermined position of the substrate processing vessel 1, a first inert gas supplying section 4 for blowing inert gas against the drying fluid 6 pooled in the fluid reservoir section 3 for drying so as to generate droplet of the drying fluid, and for guiding the droplet towards the center of the substrate processing vessel 1, and a second inert gas supplying section 5 for supplying inert gas vertically and downwardly so as to supply the generated droplet of the drying fluid towards the substrates 2, consequently safety is improved without providing special safety device, and sufficient amount of drying fluid is supplied to the dipping boundary face of the substrate and the cleaning liquid.

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Patent Owner(s)

Patent OwnerAddress
DAIKIN INDUSTRIES LTDOSAKA UMEDA TWIN TOWERS SOUTH 1-13-1 UMEDA KITA-KU OSAKA-SHI OSAKA 5300001 ?5300001
TOHO KASEI LTD6-2 IMAKOKUBU-CHO YAMATOKOURIYAMA-SHI NARA 639-1031

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maeda, Norio Nara, JP 16 96
Sotojima, Takazo Osaka, JP 10 110

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