Method for making a financial transaction card with embedded electronic circuitry
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United States of America Patent
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Jun 7, 2005
Issued Date -
N/A
app pub date -
Nov 20, 2002
filing date -
Jun 11, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.
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