Power module
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United States of America Patent
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May 31, 2005
Issued Date -
N/A
app pub date -
Mar 29, 2004
filing date -
May 16, 2000
priority date (Note) -
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Abstract
A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
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