Hot wall rapid thermal processor
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United States of America Patent
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May 31, 2005
Grant Date -
Feb 6, 2003
app pub date -
Sep 30, 2002
filing date -
Aug 12, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
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