Apparatus for detecting CMP endpoint in acidic slurries
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United States of America Patent
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May 31, 2005
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N/A
app pub date -
Jun 27, 2002
filing date -
Jun 27, 2002
priority date (Note) -
Expired
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Abstract
An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: a. A transferring means to collect a sample of the acidic CMP slurry; b. A converting means to convert the acidic CMP slurry to a basic slurry; c. A measuring means to measure the ammonia gas present in the basic slurry; d. A detection means to signal the end of an ongoing CMP cycle.
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