Method for forming resin composite material
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United States of America Patent
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May 31, 2005
Grant Date -
Jan 1, 2004
app pub date -
Nov 1, 2002
filing date -
Nov 8, 2001
priority date (Note) -
Expired
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Abstract
This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 μm or less, can be prepared that is otherwise difficult to prepare using conventional methods.
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