Apparatus for mounting semiconductor chips
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United States of America Patent
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May 24, 2005
Grant Date -
Oct 9, 2003
app pub date -
Mar 13, 2003
filing date -
Mar 28, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for mounting semiconductor chips comprises a loading station for the presentation of substrates, a first transport system and a second transport system. The first transport system removes one substrate after the other from the loading station and passes them on to the second transport system which transports the substrates in steps to a dispensing or soldering station and to a bonding station. A sensor with two coils arranged at a distance to one another is arranged in such a way that one end of the substrate transported by the first transport system travels through a gap formed between the two coils. The signal delivered by the sensor is used to determine a control signal which indicates whether or not the first transport system should pass the substrate on to the second transport system.
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