Encapsulated semiconductor package free of chip carrier
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United States of America Patent
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May 24, 2005
Grant Date -
Dec 25, 2003
app pub date -
Jun 24, 2002
filing date -
Jun 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor package and a method for fabricating the same are proposed. A chip has an active surface, and an opposing non-active surface. A plurality of conductive elements are mounted on the active surface and electrically connected to the chip. A first encapsulant is formed on the active surface of the chip, for encapsulating the active surface and conductive elements, wherein end portions of the conductive elements are exposed to outside of the first encapsulant, and adapted to be recessed in position with respect to an exposed surface of the first encapsulant. A plurality of conductive media are implanted at end portions of the conductive elements, allowing the chip to be electrically connected to an external device by the conductive elements and conductive media. A second encapsulant is formed on the non-active surface of the chip, and cooperates with the first encapsulant to provide mechanical strength for the semiconductor package.
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