DUAL STAGE PRE-HEATER
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United States of America Patent
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May 24, 2005
Grant Date -
May 26, 2005
app pub date -
Nov 7, 2003
filing date -
Nov 7, 2003
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises: a first stage configured to direct heat over a wide area of the printed circuit board; and a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
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