Method for depositing a very high phosphorus doped silicon oxide film

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United States of America Patent

PATENT NO 6893983
APP PUB NO 20040119145A1
SERIAL NO

09950755

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Abstract

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A thermal activated SACVD method for depositing a phosphorus oxide layer onto a silicon oxide wafer comprising the steps of: loading an SACVD device with a silicon oxide wafer; depositing a phosphorus doped oxide (PSG) layer on the USG layer using pure oxygen and a phosphorus and silicon source; purging the SACVD device; and depositing a boron and phosphorus doped oxide (BPSG) layer on the PSG layer.

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Patent Owner(s)

Patent OwnerAddress
TECH SEMICONDUCTOR SINGAPORE PTE LTD1 WOODLANDS INDUSTRIAL PARK D STREET 1 738799

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Au, Hing Ho Singapore, SG 1 5
Phang, Yew Hoong Singapore, SG 3 29
Sun, Jian Singapore, SG 393 5868

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