Measurement box with module for measuring wafer characteristics

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United States of America Patent

PATENT NO 6891609
APP PUB NO 20030193671A1
SERIAL NO

10120639

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.

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Patent Owner(s)

Patent OwnerAddress
RUDOLPH TECHNOLOGIES GERMANY GMBHGALILEO-GALILEI-STR 28 55129 MAINZ

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abraham, Michael Mainz, DE 25 389

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