RF transition for an area array package
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United States of America Patent
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May 10, 2005
Issued Date -
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app pub date -
Feb 14, 2002
filing date -
Feb 14, 2002
priority date (Note) -
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Abstract
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
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