Coating powder of epoxy resin and low temperature curing agent
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United States of America Patent
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May 10, 2005
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app pub date -
Oct 24, 2002
filing date -
Nov 4, 1997
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Abstract
A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent capable of maintaining its own domain during extrusion which is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having an exceptionally smooth surface with either a low or high gloss. The powder is particularly useful for coating heat sensitive substrates such as plastics, paper, cardboard and wood.
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