Wafer target design and method for determining centroid of wafer target
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United States of America Patent
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May 3, 2005
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N/A
app pub date -
Mar 7, 2000
filing date -
Mar 7, 2000
priority date (Note) -
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Abstract
A method for determining the centroid of a wafer target. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a target set formed therein. Next, a signal is passed over the target set and over a material separating target shapes in the target set. Then a return signal is reflected, and received, from the surface of the target shapes and the material separating them. A location of at least one maxima point of the return signal is identified. Finally, a centroid is determined as the median of the locations of at least one maxima point.
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