Programmable photolithographic mask system and method
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United States of America Patent
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May 3, 2005
Grant Date -
Mar 18, 2004
app pub date -
Jun 25, 2003
filing date -
Jun 27, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention overcomes many of the disadvantages of prior lithographic microfabrication processes while providing further improvements that can significantly enhance the ability to make semiconductor chips at lower cost. A new type of programmable structure for exposing a wafer allows the lithographic pattern to be changed under electronic control. This provides great flexibility, increasing the throughput and decreasing the cost of chip manufacture and providing numerous other advantages. The programmable structure consists of an array of shutters that can be programmed to either transmit light to the wafer (referred to as its 'open' state) or not transmit light to the wafer (referred to as its 'closed' state). The programmable technique is provided for creating a pattern to be imaged onto a wafer that can be implemented as a viable production technique.
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