Method of partially plating substrate for electronic devices
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United States of America Patent
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Apr 26, 2005
Grant Date -
Aug 9, 2001
app pub date -
May 19, 1999
filing date -
Aug 27, 1996
priority date (Note) -
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Abstract
The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and adhered or bonded to, via holes 22 of a TAB tape 21 and the small balls 24 are then melted so that a copper wiring 23 exposed at the via holes 22 of the TAB tape 21 can be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.
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