Underfilling material for semiconductor package
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United States of America Patent
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Apr 19, 2005
Grant Date -
Jun 17, 2004
app pub date -
Nov 26, 2003
filing date -
Jul 8, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An underfilling material for a semiconductor package holding semiconductor elements on a carrier substrate mounted on a circuit board, containing a one-pack type thermosetting urethane composition which preferably comprises a urethane prepolymer having a terminal isocyanate group, which is obtained by reacting a polyol with an excessive amount of a polyisocyanate, and a fine powder-coated curing agent comprising a curing agent which is in a solid state at room temperature and surface active sites of which are covered with a fine powder. This composition can achieve both the low temperature curing properties and the storage stability.
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