Electrolytic copper plating solution and method for controlling the same
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United States of America Patent
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Apr 19, 2005
Grant Date -
May 22, 2003
app pub date -
Dec 20, 2001
filing date -
Dec 20, 2000
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Abstract
Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.
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