Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
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United States of America Patent
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Apr 19, 2005
Grant Date -
May 20, 2004
app pub date -
Nov 18, 2002
filing date -
Nov 18, 2002
priority date (Note) -
Expired
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Abstract
Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
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