Microcomponent having intra-layer electrical isolation with mechanical robustness
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United States of America Patent
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Apr 12, 2005
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N/A
app pub date -
Oct 7, 2002
filing date -
Oct 7, 2002
priority date (Note) -
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Abstract
A system and method is disclosed that strengthens the structural integrity of trench-fill electrical isolation techniques. One embodiment provides for etching a series of interlocking geometric trenches into a device layer and filling the trenches with a non-conductive dielectric material. The dielectric material establishes electrical isolation while the interlocking geometric trenches strengthen the structural integrity of the separation by providing at least one surface on the interlocking separation that experiences a compression force for each direction that the electrically isolated MEMS component is moved.
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