Stripping method
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United States of America Patent
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Apr 12, 2005
Grant Date -
Apr 22, 2004
app pub date -
Apr 5, 2003
filing date -
Apr 6, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.
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