Marking method for semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 12, 2005
Grant Date -
N/A
app pub date -
Oct 25, 2000
filing date -
Oct 26, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A plurality of minute ID marks are inscribed on a semiconductor wafer which is under manufacture, without imposing adverse effect to the wafer, in order to make the marks less susceptible to surface treatment to be performed during the course of manufacture. Further, the minute ID marks act as mutual backups. Inscribing such minute ID marks on a semiconductor wafer prevents confusion due to effacement of ultra-minute marks and eliminates worry about the impossibility of tracing a semiconductor wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully