Temperature control sequence of electroless plating baths
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United States of America Patent
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Apr 5, 2005
Grant Date -
Dec 25, 2003
app pub date -
Jun 21, 2002
filing date -
Jun 21, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than the minimum deposition temperature, in an apparatus outside the plating chamber. Then the solution is introduced into the plating chamber without the occurrence of the deposition. After the chamber is filled, the solution is heated up to the desired deposition temperature. The deposition is initialized. After the deposition, the solution is returned back to the original tank.
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